Our devices are fabricated on premium SiC epitaxial wafers using proprietary thermal processing that produces an exceptionally stable gate oxide — delivering outstanding long-term reliability under demanding high-voltage, high-frequency switching.
Combined with precision-engineered doping profiles and advanced edge-termination technology, our devices achieve ultra-low on-resistance (RDS(on)) without compromising voltage ruggedness — enabling higher voltages, greater power density, superior thermal performance and smaller system footprints.