Foundry // Services & Capabilities
Foundry services
Custom manufacturing and production services across our Silicon Carbide and III-V compound-semiconductor fabs — with wafer and packaging process services to support both R&D and production demands.
01 — Overview
Two fabs, full-service support
Cactus Materials runs two semiconductor fabs totaling 40,000 sq ft in Tempe, Arizona — a Silicon Carbide (SiC) fab for high-power devices and a III-V compound-semiconductor fab for AI photonics. We bring extensive fab experience across many markets, and provide wafer and packaging process services to support R&D and production.
02 — Fab capabilities
State-of-the-art process capability
Compound Semiconductor Epitaxial Fab
Precision epitaxial growth for III-V compound-semiconductor devices.
Wafer size up to 200 mm
Silicon Carbide High-Voltage / High-Temp Devices
SiC device fabrication for high-voltage, high-temperature power applications.
Wafer size up to 150 mm
03 — What we offer
Foundry & process services
Custom Manufacturing
Precision engineering for specialized, application-specific devices.
Production Services
Scalable, high-volume manufacturing on mature platforms.
Wafer Process Services
Epitaxial growth and wafer processing for R&D and production.
Packaging Support
Advanced packaging solutions — including wafer bonding, chip-level bare die, TO247, SOT227, and custom packaging — with partner support from prototype to production.
Foundry Capabilties
Photonics, Power, and Custom Epi capabilities across GaAs, eGaAs, InP, and SiC platforms - from 650V to 3300V, 850nm to 1700nm.
