Strategic Services
Our main business is designing & manufacturing our own products as an Integrated Device Manufacturer.
Key Capabilities
- State-of-the-art Compound Semiconductor Epitaxial fab (up-to 200 mm)
- 3D AI Optical Chip Integration and Packaging fab through wafer bonding (up-to-200 mm)
- Silicon Carbide (SiC) High Voltage and High Temperature Devices (up-to-150 mm)
SiC Silicon Carbide Foundry Services (30% of the Fab Capacity maximum)
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III-V Epitaxy Wafer Development
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Heterogenous 3D Integration (W2W) Wafter-To-Wafer
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*Rad-Hard” Radiation Hardened* engineered Silicon Substrate
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Key Equipment
- State-of-the-art 40,000 sq. ft
- Class 100 clean room
- 100+ pieces of advanced equipment and tools
