Capabilities

Single Process Steps & Short Loops, Gold Wafer Depostion for HiRel / Rad Hard / RF.

Photolithography– Karl Suss Microtec  Aligners, Thin Film Deposition–Sputtering, PECVD,  E-Be&am Evaporation. Frontside/Backside Metal Deposition–Ti/TiW/AlCu, Ti/Ni/Ag, Ti/Pt/Au, ALCu. Thermal Oxidation and Diffusion–Thermco, Wet (Chemical) Etch. Plasma Dry Etch. RIE Etch. RTA.

Device Design, Wafer Thinning, Wafer Dicing, 3D Packaging & Test